The Kulicke and Soffa 780 dicing saw is a back-end processing tool for cutting wafers or substrates, typically silicon or quartz, into smaller pieces or chips for packaging or further processing.
Some of the features of this tool are:
Integrated semi-automatic computer controlled precision saw. It is menu driven, with a multi-axis cutting stage with automatic indexing.
Employs an extremely thin diamond impregnated cutting wheel with water cooling. The 2" wheel is mounted on an air spindle which is driven at speeds up to 32,000rpm.
The chuck accepts up to 6" diameter wafers.
Video monitor for online inspection and alignment.
Capable of cutting a wide variety of materials such as silicon, quartz, metal coated substrates, glass, ceramics, and sapphire.