The Corial ICP-RIE is designed to use flourine based chemistries to etch oxides and nitrides using a high density plasma, which enables very fast etch rates. The adjustable RF-bias allows for fine tuning the level of ion bombardment on the surface. |
The Corial ICP-RIE is designed to use flourine based chemistries to etch oxides and nitrides using a high density plasma, which enables very fast etch rates. The adjustable RF-bias allows for fine tuning the level of ion bombardment on the surface. |